| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem such that there is provided a semiconductor device to which a semiconductor element is mounted with a printed substrate, a ceramic substrate, a flexible sheet, etc., as a support substrate, but these support substrates are not intrinsically necessary and are surplus materials, and moreover a thickness of the support substrate increases a size of the semiconductor device. SOLUTION: A first conductive path 51A is formed lower than a semiconductor element 52A, and a conductive path 51 and a semiconductor element 52 are supported by an insulating resin 50 to realize a semiconductor device. Accordingly, a top part of a metal fine wire 55A can be lowered and a thickness of a semiconductor device 53 can be thinned. |
