| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for mounting a semiconductor that has a sufficient insulation resistance between electrodes and that has a less load when pressure- contacted. SOLUTION: In a socket for mounting the semiconductor comprising a framework for connection in a face-to-face position to a circuit board 110 mounted with a packaged semiconductor 100 and pressure-contacting type connectors to obtain an electric connection by compressing the package from an upper side, the pressure-contacting type connector 14 comprises an insulating elastomer 21 on a flat plate, metal wires 16 arranged on both sides of this elastomer and a plate 20 with holes in a position equivalent to an electrode of the semiconductor. The metal wires 16 are plurally arranged through the holes of the plate 20 and formed as an electrode part.
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