发明名称 ULTRASONIC WAVE PROBE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an ultrasonic wave probe whose downsizing is promoted and to provide a manufacturing method for the ultrasonic wave probe with enhanced productivity. SOLUTION: In the ultrasonic wave probe where a plurality of piezoelectric elements is arranged on a packing material in a cross direction, the electrode of a lower face of the piezoelectric elements is led out through a metallic foil, and the metallic foil and a conductor path formed alternately on both major sides of a flexible board are connected with a conductor wire, the flexible board consists of a wide part and a narrow part and the wide part is placed on the side face of the packing material to alternately form the exposed conductor path at the tips on both major sides. A plurality of the piezoelectric elements is arranged in a cross direction on the packing material, the electrodes on the lower side of the piezoelectric element are led out through a metallic foil, and the metallic foil and the conductor path formed alternately on both major sides are connected with a lead wire in the manufacturing method of the ultrasonic probe. After connecting one end of the lead wire to the conductor path of the one major side of the flexible board, the one end of the lead wire is connected to the conductor path of the other major side of the flexible board, and the other end of the lead wire is connected to the metallic foil in the manufacturing method.
申请公布号 JP2001275192(A) 申请公布日期 2001.10.05
申请号 JP20000086768 申请日期 2000.03.27
申请人 NIPPON DEMPA KOGYO CO LTD 发明人 HASEGAWA YASUNOBU
分类号 A61B8/00;H04R17/00;(IPC1-7):H04R17/00 主分类号 A61B8/00
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