| 摘要 |
PROBLEM TO BE SOLVED: To more correctly measure a temperature by suppressing the effects due to surrounding members. SOLUTION: This temperature-measuring plate 1 for falsely measuring a heat history of a semiconductor wafer or the like subjected to heat treatment is comprised of a measuring plate part 2 such as a flat plate formed of the same material as a material of the semiconductor wafer, temperature-measuring parts 3 set on the measuring plate part 2 and lead wires 4, extending from the temperature-measuring parts 3. The measuring plate 2 is constituted of two flat parts 2A and 2B. Each of the flat plate parts 2A and 2B is formed in a thickness half of the thickness of the semiconductor wafer, and the flat plate parts when laminated are made equal in size to that of the semiconductor wafer. Dent parts 5 and lead wire storage grooves 6 are formed on an inside face of each of the flat plate parts 2A and 2B. The flat plate parts 2A and 2B are combined, while the temperature-measuring part 3 are stored in the dent parts 5 and the lead wires 4 are stored in the wire storage grooves 6 respectively. As a consequence of this, the lead wires 4 are disposed towards an outer circumference from a circumferential edge part of the measuring plate part 2, whereby the effects by the lead wires 4 are eliminated.
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