发明名称 Polyamide resin composition and film produced from the same
摘要 The present invention relates to a polyamide resin composition comprising 100 parts by weight of a polyamide resin and 0.001 to 2 parts by weight of at least two kinds of fillers having different average particle sizes from each other, an average particle size of a filler having minimum average particle size in said at least two kinds of fillers being 0.001 to 2 mum, an average particle size of a filler having maximum average particle size in said at least two kinds of fillers being more than 2 mum and not more than 15 mum, said at least two kinds of fillers having the following particle size distribution: (a) 20 to 90% by weight of a filler having a particle size of not more than 2 mum, (b) 0 to 15% by weight of a filler having a particle size of more than 2 mum and less than 3 mum, and (c) 10 to 80% by weight of a filler having a particle size of not less than 3 mum.
申请公布号 US2001027230(A1) 申请公布日期 2001.10.04
申请号 US20010785796 申请日期 2001.02.16
申请人 URABE HIROSHI;MORIMOTO SEIJI;MATSUI HIROMICHI 发明人 URABE HIROSHI;MORIMOTO SEIJI;MATSUI HIROMICHI
分类号 C08J5/18;C08K3/00;(IPC1-7):C08K3/34 主分类号 C08J5/18
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