| 摘要 |
Methods are disclosed for fabricating any of various semiconductor devices that include a reinforcing substrate bonded to a device substrate, wherein stresses between the two substrates are reduced compared to conventional devices. In the context of a back-surface-incidence (BSI) CCD light sensor, one or more pixels of a light-sensing array are formed on the surface of a "CCD" or "device" substrate. A layer of a curable resin adhesive is applied to the upper surface of the device substrate. A reinforcing substrate (e.g., glass) is placed on the layer of uncured adhesive, and the adhesive is cured. After curing the resin adhesive has a hardness of no greater than 40 (as measured by the JIS-A standard). With such an adhesive, when the resin adhesive cures, no stress is applied to the device substrate even a difference exists in the thermal expansion coefficients of the cured adhesive and the device substrate.
|
