发明名称 |
Vertically mountable and alignable semiconductor device, assembly, and methods |
摘要 |
A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicularly from a bottom edge thereof. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.
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申请公布号 |
US2001026023(A1) |
申请公布日期 |
2001.10.04 |
申请号 |
US20010873869 |
申请日期 |
2001.06.04 |
申请人 |
KINSMAN LARRY D.;MODEN WALTER L.;FARNWORTH WARREN M. |
发明人 |
KINSMAN LARRY D.;MODEN WALTER L.;FARNWORTH WARREN M. |
分类号 |
H01L25/10;H05K3/30;(IPC1-7):H01L23/544 |
主分类号 |
H01L25/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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