发明名称 Method of holding substrate and substrate holding system
摘要 A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.
申请公布号 US2001025608(A1) 申请公布日期 2001.10.04
申请号 US20010849405 申请日期 2001.05.07
申请人 TAMURA NAOYUKI;TAKAHASHI KAZUE;ITO YOUICHI;OGAWA YOSHIFUMI;SHICHIDA HIROYUKI;TSUBONE TSUNEHIKO 发明人 TAMURA NAOYUKI;TAKAHASHI KAZUE;ITO YOUICHI;OGAWA YOSHIFUMI;SHICHIDA HIROYUKI;TSUBONE TSUNEHIKO
分类号 H01L21/00;H01L21/68;H01L21/683;(IPC1-7):C23C16/00 主分类号 H01L21/00
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