发明名称 |
Method of holding substrate and substrate holding system |
摘要 |
A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.
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申请公布号 |
US2001025608(A1) |
申请公布日期 |
2001.10.04 |
申请号 |
US20010849405 |
申请日期 |
2001.05.07 |
申请人 |
TAMURA NAOYUKI;TAKAHASHI KAZUE;ITO YOUICHI;OGAWA YOSHIFUMI;SHICHIDA HIROYUKI;TSUBONE TSUNEHIKO |
发明人 |
TAMURA NAOYUKI;TAKAHASHI KAZUE;ITO YOUICHI;OGAWA YOSHIFUMI;SHICHIDA HIROYUKI;TSUBONE TSUNEHIKO |
分类号 |
H01L21/00;H01L21/68;H01L21/683;(IPC1-7):C23C16/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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