Flip-chip semiconductor device with backside contact

摘要

The semiconducting component has a chip (1) with a front side (2) with at least one chip connection with which the component can be attached to a carrier (8), whereby the front side faces the carrier, and a rear side (3) opposite the front side. A contact element (5) connected to the rear side of the chip over a large area has at least one connection element (6) attached to the carrier.