发明名称 |
Device for mounting semiconductor chips on a substrate especially a metallic lead-frame has a sensor for detecting a first longitudinal edge of the substrate enabling accurate chip positioning across the substrate |
摘要 |
Device mounts chips on a substrate, especially a metallic lead-frame (1) with the substrate moved in steps in a first direction (x), while a sensor (12) determines the position of an edge (4) of the substrate in a second direction (y). The sensor comprises light source and two adjacent light paths with one acting as a reference. |
申请公布号 |
DE10110955(A1) |
申请公布日期 |
2001.10.04 |
申请号 |
DE2001110955 |
申请日期 |
2001.03.07 |
申请人 |
ESEC TRADING S.A., CHAM |
发明人 |
MANNHART, EUGEN;ENZLER, AUGUST;ODERMATT, ANDRE |
分类号 |
H05K13/04;G01D5/34;H01L21/00;H01L21/68;(IPC1-7):H01L21/58;G01B11/00;G01B11/24;G05D3/12 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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