发明名称 |
Polishing apparatus and method thereof |
摘要 |
A polishing apparatus which attaches the semi-conductor wafers 5 to the polishing plate 4 for performing the polishing as applying pressure the polishing cloth with the semi-conductor wafers, is provided with a guide ring 7 disposed outside of the polishing plate for pressing the polishing cloth separately from the polishing plate, a retainer ring 8 provided at the lower end of the guide ring for contacting the polishing cloth, and a weight 9 detachably mounted on the upper surface of the guide ring for adjusting the pressure to the polishing cloth.
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申请公布号 |
US2001027081(A1) |
申请公布日期 |
2001.10.04 |
申请号 |
US20010798980 |
申请日期 |
2001.03.06 |
申请人 |
SAKAMOTO TAKAO;KAWAMOTO SHINYA;KOTARI KATSUAKI;KOJIMA KATSUYOSHI;SAITOU MASAYOSHI;HOSHI YOSHIHIKO |
发明人 |
SAKAMOTO TAKAO;KAWAMOTO SHINYA;KOTARI KATSUAKI;KOJIMA KATSUYOSHI;SAITOU MASAYOSHI;HOSHI YOSHIHIKO |
分类号 |
B24B37/04;B24B41/06;(IPC1-7):B24B1/00;B24B5/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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