发明名称 |
Polishing pad and method of manufacture |
摘要 |
A method of joining sections of polishing pad for use in the chemical mechanical planarization of a semiconductor wafer. Two sections of polishing pad are positioned so that they contact one another. The two sections are then welded together to create a robust joint. The joint is resistant to infiltration of slurry and is not susceptible to delamination that commonly occurs in a typical laminate joint. <IMAGE> |
申请公布号 |
EP1112816(A3) |
申请公布日期 |
2001.10.04 |
申请号 |
EP20000311271 |
申请日期 |
2000.12.15 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
PHAM, XUYEN |
分类号 |
B24B37/20;B24D11/06;B29C53/38;B29C65/00;B29C65/02;B29C65/04;B29C65/06;B29C65/08;B29C65/10;B29C65/50;H01L21/304 |
主分类号 |
B24B37/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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