Chip structure used in electronic devices comprises a semiconductor chip arranged on a substrate with a surface having connecting surfaces facing away from the substrate

摘要

Chip structure (1) comprises semiconductor chip (3) arranged on substrate (2) with surface having connecting surfaces (5) facing away from substrate. The connecting surfaces are electrically connected to the contact surfaces (7) of the substrate via electrically conducting contacts (6) made from a hardenable conducting composition applied between the connecting surfaces and the contact surfaces. Preferred Features: The chip is fixed to a plastic support and the electrically conducting contacts are connected in the support to the contact surfaces in a copper layer via through-holes.