| 摘要 |
It is an object of the invention to provide an electronic circuit device in which semiconductor elements, resistors, capacitors and the like are packaged onto an insulating substrate such as a ceramic substrate or the like, wherein high-density packaging is realized. A circuit module (1, 2) comprises a terminal section (5, 9) having an annular insulating frame body (3) and a plurality of terminals (4, 8) provided on respective portions of the frame body to extend outwardly therefrom, and a circuit substrate (7) having wiring patterns each adapted for connection with the respective terminals (4, 8) of the terminal section (5, 9) and packaging to one surface of the circuit substrate (7) surface packaging parts, the circuit substrate (7) being connected to the terminals (4, 8) with the surface packaging parts directed toward the inside of the terminal section. one circuit module (1) is stacked on the other circuit module (2) to be connected to the latter by the terminals (4, 8). Thus high-density packaging can be readily realized. <IMAGE> |
