CURABLE COMPOSITION AND MULTILAYERED CIRCUIT SUBSTRATE

摘要

A multilayered circuit substrate which is excellent in flame retardancy, insulating properties, and adhesion and generates no harmful substances upon incineration; and a curable composition suitable for obtaining the substrate. The curable composition comprises an insulating resin such as an alicyclic olefin polymer or aromatic polyether polymer, a nitrogenous hardener such as 1,3-diallyl-5-glycidyl isocyanurate, and a phosphorus compound flame retardant such as a phosphoric ester amide. The multilayered circuit substrate is obtained by forming the curable composition into a film by the solution casting method, superposing this film on an inner-layer substrate, and curing it.