USE OF CESIUM HYDROXIDE IN A DIELECTRIC CMP SLURRY
摘要
Chemical mechanical polishing compositions including an abrasive and cesium hydroxide and methods for polishing dielectric layers associated with integrated circuits using cesium hydroxide containing polishing compositions.
申请公布号
WO0132793(A8)
申请公布日期
2001.10.04
申请号
WO2000US41707
申请日期
2000.10.31
申请人
CABOT MICROELECTRONICS CORPORATION
发明人
FRANCIS, ALICIA, F.;MUELLER, BRIAN, L.;DIRKSEN, JAMES, A.;FEENEY, PAUL, M.
