PHOTOCURABLE PASTE COMPOSITION AND FORMATION OF INORGANIC BURNED PATTERN THEREFROM

摘要

A photocurable paste composition which comprises (A) fine inorganic particles, (B) a binder polymer having no ethylenically unsaturated double bonds, (C) one or more photocurable compounds, and (D) a photopolymerization initiator. The ingredient (B) is preferably used as a solution in at least one of the compounds (C). The compounds (C) preferably comprise a liquid monofunctional photocurable compound having one ethylenically unsaturated double bond per molecule and a polyfunctional photocurable compound having two or more ethylenically unsaturated double bonds per molecule. The composition is advantageously applicable to a technique in which an inorganic burned pattern, such as a partition wall pattern, electrode (conductor circuit) pattern, or dielectric (resistor) pattern, to be used in PDPs, FEDs, LCDs, or the like is formed while utilizing grooves (recessed parts) of a given pattern.