发明名称 |
METHOD AND DEVICE FOR MONITORING ELECTRIC COMPONENTS IN A PICK-AND-PLACE DEVICE FOR SUBSTRATES |
摘要 |
The invention relates to a method and to a device for monitoring electric components in a pick-and-place device for substrates. The underside of a pick-up (2) is monitored by an optical scanning means (7) during the pick-up phase and during the placing phase of a component (10). A lift drive (3) for the pick-up (2) is provided with a position sensor (5) that is linked with a control device (6). The scanning means (7) emits and receives a scanning beam (22) oriented transversally to the direction of lift and is likewise coupled with the control device (6), thereby allowing to monitor the underside of the pick-up (2) in a direct time-related manner with the picking and placing of the component (10). The various lift positions are saved and compared when a threshold value of the received scanning beam (22) is exceeded so that the inventive device also allows for a monitoring of the height of the component. |
申请公布号 |
WO0174127(A1) |
申请公布日期 |
2001.10.04 |
申请号 |
WO2001DE00964 |
申请日期 |
2001.03.14 |
申请人 |
SIEMENS PRODUCTION AND LOGISTICS SYSTEMS AG;BURGER, STEFAN;DUEBEL, RAINER |
发明人 |
BURGER, STEFAN;DUEBEL, RAINER |
分类号 |
G01B11/00;H05K13/04;H05K13/08 |
主分类号 |
G01B11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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