Aqueous dispersion for chemical mechanical polishing of insulating films

摘要

The invention provides an aqueous dispersion for chemical mechanical polishing that can limit scratches of a specific size to a specific number. When using the aqueous dispersion for chemical mechanical polishing of an interlayer insulating film with an elastic modulus of no greater than 20GPa as measured by the nanoindentation method, the number of scratches with a maximum length of 1 mu m or greater is an average of no more than 5 per unit area of 0.01mm<2> of the polishing surface. The aqueous dispersion contains a scratch inhibitor agent and an abrasive.