发明名称 |
Semiconductor device and method for fabricating the device |
摘要 |
A first gate electrode for an n-channel MOSFET includes first and second metal films and a low-resistivity metal film. The first metal film has been deposited on a first gate insulating film and is made of a first metal having a work function located closer to the conduction band of silicon with reference to an intermediate level of silicon bandgap. The second metal film has been deposited on the first metal film and is made of a second metal having a work function located closer to the valence band of silicon with reference to the intermediate level of silicon bandgap. The low-resistivity metal film has been deposited on the second metal film. A second gate electrode for a p-channel MOSFET includes: the second metal film, which has been deposited on a second gate insulating film and is made of the second metal; and the low-resistivity metal film deposited on the second metal film.
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申请公布号 |
US2001027005(A1) |
申请公布日期 |
2001.10.04 |
申请号 |
US20010818550 |
申请日期 |
2001.03.28 |
申请人 |
MORIWAKI MASARU;YAMADA TAKAYUKI |
发明人 |
MORIWAKI MASARU;YAMADA TAKAYUKI |
分类号 |
H01L29/43;H01L21/28;H01L21/336;H01L21/8238;H01L27/092;H01L29/78;(IPC1-7):H01L21/823;H01L21/320;H01L21/476;H01L29/76;H01L27/01 |
主分类号 |
H01L29/43 |
代理机构 |
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代理人 |
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地址 |
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