Soldering method for soldering electronic parts and soldering apparatus therefor

摘要

The heating surface of an iron member is contacted to the upper surface of an electronic part such as a semiconductor chip to be mounted on a wiring substrate. Then solder electrode sections (solder balls) on the electronic part are dissolved so that the electronic part is soldered to a cupper foil pattern on the wiring substrate. And only the electronic parts necessary to be soldered are heated at a uniform heating temperature without influencing the periphery. Moreover, the iron member is moved by a moving head (iron head), and the wiring substrate is placed on a moving table to be moved. A semiconductor chip is mounted at a predetermined position on the wiring substrate by the movement of the iron member and the semiconductor substrate. The iron member is provided with a function of holding the semiconductor chip by attracting it, and thus the iron member has a function of a soldering apparatus and a function of a chip mounter.