| 摘要 |
<p>A wafer support apparatus (14) of the present invention comprises a wafer support body (22) having a support area (26) for supporting a wafer W, in an upper surface thereof; and a plurality of lift members (36), each extending from the outside of the support area to the inside of the support area of the wafer support body, having a slope surface sloping downward toward the inside, in an upper surface, and being vertically movable between a lower position and an upper position with respect to the upper surface of the wafer support body. <IMAGE></p> |
