Verfahren zum Montieren von Schaltungsteilen auf ein biegsames Substrat

摘要

A method of mounting circuit components (12) to conductors of printed circuits on a flexible substrate (10) comprising the following steps (a) locating the substrate (10) in a first predetermined position on a carrier (14) having a reflective surface (16) remote from the substrate (b) locating a cover (20) having an opening (22) therein in a second predetermined position on the carrier and clamping the cover and the carrier together to provide a carrier assembly (8) in which the substrate (10) is clamped between the carrier (14) and the cover (20), the opening in the cover being so positioned and shaped as to leave exposed a region (26) of the substrate on which the components are to be placed, and a surface (28) of the cover remote from the carrier being reflective (c) applying solder paste to selected parts of the conductors in the exposed region (26) of the substrate (10) (d) placing components (12) on the substrate (10) with contacts of the components in engagement with the solder paste (e) exposing the carrier assembly (8) to radiant heat to preheat the deposited solder paste to a first elevated temperature (f) thereafter exposing the deposited solder paste to further heat to raise the solder paste to a second elevated temperature whereby to soften the solder paste; and (g) allowing the solder paste to cool or cooling the solder paste whereby to cause it to solidify and adhere firmly to the conductors and the contacts of the components.