发明名称 |
Method of fabricating a transistor in a semiconductor device |
摘要 |
Forming a semiconductor transistor by embedding the gate electrode into the substrate so that a step difference between the gate electrode and the source or drain region is reduced. Device isolation areas are defined by forming at least two first trenches having a first depth. The gate electrode is formed in a second trench located between the first trenches at a second depth being less than the first depth. A source and a drain are respectively formed between the gate electrode and the device isolation areas. The gate electrically connects the source and drain to form a semiconductor channel in the substrate.
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申请公布号 |
US2001025982(A1) |
申请公布日期 |
2001.10.04 |
申请号 |
US20010818759 |
申请日期 |
2001.03.28 |
申请人 |
PARK SEONG-HYUNG;JANG MYOUNG-JUN |
发明人 |
PARK SEONG-HYUNG;JANG MYOUNG-JUN |
分类号 |
H01L21/336;H01L21/762;(IPC1-7):H01L29/76;H01L29/94;H01L31/062;H01L31/113;H01L31/119 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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