发明名称 THROUGH HOLE INSPECTING METHOD AND DEVICE
摘要 A through hole inspecting method and device for inspecting a through hole at low cost with good precision. A light source and a sensor camera having imaging devices are provided on both sides of a table where a work having a through hole is placed. The light emerging from the through hole is captured by the sensor camera. The focal position of the sensor camera is shifted from the surface of the work to apparently enlarging the area for capturing the light emerging from the through hole.
申请公布号 WO0173411(A1) 申请公布日期 2001.10.04
申请号 WO2001JP02641 申请日期 2001.03.29
申请人 SEIKO EPSON CORPORATION 发明人 SAITO, MIKIO;GOTO, NOBORU;ISHIKAWA, TOSHIAKI
分类号 G01N21/894;G01N21/94;G01N21/954;G01N21/956;H01L21/66;(IPC1-7):G01N21/94;G01M11/00 主分类号 G01N21/894
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