发明名称 |
PHOTOCURABLE/THERMOSETTING RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM FORMED THEREFROM, AND METHOD OF FORMING PATTERN WITH THE SAME |
摘要 |
A photocurable/thermosetting resin composition which comprises (A) a photosensitive prepolymer having both at least one carboxyl group and at least two ethylenically unsaturated double bonds per molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups per molecule, and (E) a curing accelerator. It is alkali-developable, and can be formulated so as to be of the one-pack type. This composition and a photosensitive dry film formed therefrom are useful as various resist materials and insulating materials, in particular, a solder resist for printed circuit boards, an interlayer dielectric for build-up multilayered printed circuit boards, etc. |
申请公布号 |
WO0173510(A1) |
申请公布日期 |
2001.10.04 |
申请号 |
WO2001JP02590 |
申请日期 |
2001.03.28 |
申请人 |
KANAGAWA UNIVERSITY;TAIYO INK MANUFACTURING CO., LTD.;ONODERA, EIKO HF;NISHIKUBO, TADATOMI;KAMEYAMA, ATSUSHI;SASAKI, MASAKI;KUSAMA, MASATOSHI |
发明人 |
ONODERA, SEIYA DI;NISHIKUBO, TADATOMI;KAMEYAMA, ATSUSHI;SASAKI, MASAKI;KUSAMA, MASATOSHI |
分类号 |
C08F2/48;C08G65/18;G03F7/004;G03F7/038;H05K3/28;H05K3/46;(IPC1-7):G03F7/027;C08L63/10;C08F299/02;C08F290/06 |
主分类号 |
C08F2/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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