| 摘要 |
The present invention proposes Pb-free soldering alloy which does not comprise any amount of Pb to prevent the environment from being contaminated by Pb when the soldered product is put on a wasteyard and to enhance the mechanical strength at the soldered joint by the soldering alloy. The Pb-free soldering alloy is characterized in that it comprises Cu in 0.05 to 2.0 wt.%, Ni in 0.001 to 2.0 wt.% and Sn in the balance. |
