发明名称 |
Film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof |
摘要 |
A film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof wherein a plurality of chip semiconductor devices are laminated onto a substrate. Each chip semiconductor device includes a film carrier tape having leads, a semiconductor chip electrically connected to the leads, a heat sink mounted to a surface of the chip, and a connector for mounting the heat sink, the connector being electrically connected to the leads of the film carrier tape. The film carrier tape includes a carrier member having a metallic layer superposed thereon which is etched so as to form the leads and the heat sink. |
申请公布号 |
US6297074(B1) |
申请公布日期 |
2001.10.02 |
申请号 |
US19950464577 |
申请日期 |
1995.06.05 |
申请人 |
HITACHI, LTD. |
发明人 |
MIYANO ICHIRO;SERIZAWA KOJI;TANAKA HIROYUKI;SHINODA TADAO;SAKAGUCHI SUGURU |
分类号 |
H01L23/40;H01L21/98;H01L23/367;H01L23/495;H01L23/52;H01L25/065;H01L25/07;H01L25/10;H01L25/11;H01L25/18;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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