发明名称 TREATING METHOD OF MATERIAL TO WHICH PCB ADHERES
摘要 PROBLEM TO BE SOLVED: To efficiently and safely treat the instruments contaminated by PCB. SOLUTION: Crushing treatment, melting treatment and solidifying treatment are performed in order. In the crushing treatment, the instruments to which PCB adheres is crushed into small pieces. In the melting treatment, the small pieces of the crushed instruments are molten by heating to decompose the PCB to harmless components. In the solidifying treatment, the molten matter of the small pieces of the instruments is cooled to solidify the molten matter to solid. The reuse and disposal of the solid are easily performed by solidifying the molten matter of the instruments after fractionating the molten matter to metal solid 11 and inorganic solid 12.
申请公布号 JP2001269654(A) 申请公布日期 2001.10.02
申请号 JP20000084785 申请日期 2000.03.24
申请人 OGUCHI YOSHIHIRO;NEC ENVIRONMENT ENG LTD 发明人 OGUCHI YOSHIHIRO;YOKOYAMA KENJI
分类号 A62D3/32;A62D3/40;A62D101/22;B09B5/00;C07B35/06;C07C25/18;(IPC1-7):B09B5/00;A62D3/00 主分类号 A62D3/32
代理机构 代理人
主权项
地址