| 摘要 |
PROBLEM TO BE SOLVED: To provide a treatment method for semiconductor materials or the like capable of further effectively removing the impurities sticking to the surfaces of media to be treated and completely removing even the impurities intruding into surface grooves known as trenches and confined by air. SOLUTION: The media W to be treated are housed in a hermetically closed process chamber 1 and, while the treating liquid in the chamber is boiled under reduced pressure during the water washing treatment by the treating liquid sent into the chamber from its bottom, the water washing treatment is executed, by which the impurities sticking to the surface of the media W to be treated are effectively removed and further, even the impurities in the surface grooves 6, etc., known as the trenches are effectively flushed away and are completely removed.
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