| 摘要 |
In a shielded connector having a connector housing subjected to conductive electroplating, a conductive shield ring is fitted into a housing chamber of the connector housing and a partner-side shield contact portion is inserted into the inside of the shield ring. The shield contact has resilient contact pieces and is slidable within a predetermined range within the shield ring. The shield contact has a split portion so that is has resilience in the diameter expanding direction thereof. The shield contact is locked with the shield ring. A pressure-insertion space is formed within the housing chamber and the shield ring is provided with pressure-insertion portions.
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