发明名称 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
摘要 |
An epoxy resin composition comprising (A) a biphenyl skeleton epoxy resin, (B) a biphenyl skeleton phenolic resin as a curing agent, (C) molybdenum compound, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.
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申请公布号 |
US6297306(B1) |
申请公布日期 |
2001.10.02 |
申请号 |
US19990310924 |
申请日期 |
1999.05.13 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
OSADA SHOICHI;AOKI TAKAYUKI;SHIOBARA TOSHIO;TOMIYOSHI KAZUTOSHI;ASANO EIICHI |
分类号 |
C08K3/22;(IPC1-7):C08K3/10;C08K9/00 |
主分类号 |
C08K3/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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