发明名称 Method for the formation of a planarizing coating film on substrate surface
摘要 A method is disclosed for the formation of a planarizing coating film on the surface of a substrate having a stepped level difference under processing for the manufacture of semiconductor devices. The inventive method capable of giving a planarizing coating film of excellent planarity and good adhesion to the substrate surface comprises the steps of:(a) coating the substrate surface with a coating solution containing, as a film-forming solute uniformly dissolved in an ,organic solvent, a nitrogen-containing organic compound such as benzoguanamine and melamine having, in a molecule, at least two amino and/or imino groups each substituted for the nitrogen-bonded hydrogen atom by a hydroxyalkyl group or an alkoxyalkyl group to form a coating layer;(b) drying the coating layer by evaporating the organic solvent to form a dried coating layer; and(c) subjecting the dried coating layer to a baking treatment at a temperature in the range from 150 to 250° C.
申请公布号 US6297174(B2) 申请公布日期 2001.10.02
申请号 US20010765276 申请日期 2001.01.22
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 IGUCHI ETSUKO;HIROSAKI TAKAKO;KOBAYASHI MASAKAZU
分类号 C09D161/26;H01L21/312;H01L21/768;H01L23/522;(IPC1-7):H01L21/31 主分类号 C09D161/26
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