| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid resin composition for semiconductor sealing which has high reliability to such as soldering crack resistance. SOLUTION: The liquid resin composition for semiconductor sealing comprises a reaction product obtained by reacting a cyanate ester with a silicone-modified epoxy resin and an inorganic filler, and a semiconductor device is made of the liquid resin composition as the sealant.
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