| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable thermal head capable of being reduced in size. SOLUTION: The thermal head comprises a glaze layer 2 formed on a support substrate 1, a plurality of heating resistor layers 3 formed on the top face of the glaze layer 2 each being in a band shape, a common electrode 4 and a plurality of individual electrodes 5 which are provided on the top face of each of heating resistor layers 3, a protection layer 6 covering a portion in the vicinity of a protruding heating section 3a of each heating layer 3, a conductive layer 7 for preventing electrostatic charge formed on the top face of the protection layer 6, and bonding pad sections 8 each being formed by removing a part of the protection layer 6 to expose the individual electrode 5. As the conductive layer 7 for preventing electrostatic charge and the common electrode 4 are contacted with each other to form the interface contact, it is possible to lower the contact resistance between them. As the conductive layer 7 is formed on the whole face of the substrate and then the conductive layer 7 in the vicinity of the bonding pad section 8 is removed by a lift-off method, it is possible to surely remove the conductive layer 7 in a simple making method.
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