Printed circuit board and method for evaluating the inner layer hole registration process capability of the printed circuit board manufacturing process

摘要

A printed circuit board includes a plurality of dielectric substrates. Each of the dielectric substrates includes a first and a second surface and has a first conductive layer formed on the first surface of the respective dielectric substrate. A first pattern of lands is formed in the conductive layer of at least two of the dielectric substrates. The pattern of lands of each dielectric substrate is substantially the same. An opening is formed through each of the lands to expose the respective dielectric substrate. Each of the openings in a respective pattern of lands has a diameter different than at least a portion of the other openings in the same pattern. The plurality of dielectric substrates are laminated in stacked relationship.