发明名称 |
Application of pure aluminum to prevent pad corrosion |
摘要 |
A method of forming a layer of top level metal within a semiconductor bonding pad that eliminates the formation of surface pitting and surface corrosion that using Prior Art occur due to the presence of minor traces of copper or silicon in that surface. A layer of pure aluminum is deposited on top of the first level metal surface, this level of pure aluminum prevents the occurrence of surface pitting and surface corrosion.
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申请公布号 |
US6297160(B1) |
申请公布日期 |
2001.10.02 |
申请号 |
US19990266881 |
申请日期 |
1999.03.12 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY |
发明人 |
CHIEN WEN-CHENG |
分类号 |
H01L21/768;H01L23/532;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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