发明名称 |
Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece |
摘要 |
A method is for simultaneously cutting off a multiplicity of wafers from a hard, brittle workpiece which has a longitudinal axis and a peripheral surface. The workpiece is guided, by means of a translational relative movement, directed perpendicular to the longitudinal axis, between the workpiece and a wire web of a wire saw with the aid of a feed device, through the wire web which is formed by a sawing wire. The workpiece is rotated about the longitudinal axis while the wafers are being cut off. There is also a wire saw which is suitable for carrying out the method and has a device for holding and for rotating the workpiece about the longitudinal axis.
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申请公布号 |
US6295977(B1) |
申请公布日期 |
2001.10.02 |
申请号 |
US19990434582 |
申请日期 |
1999.11.04 |
申请人 |
WACKER CHEMIE GMBH;WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG |
发明人 |
RIPPER BERT;ANDRAE CHRISTIAN;EGGLHUBER KARL;LUNDT HOLGER;KOELKER HELMUT;GREIM JOCHEN |
分类号 |
B24B27/06;B23D57/00;B28D5/00;B28D5/04;(IPC1-7):B28D1/06 |
主分类号 |
B24B27/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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