Air-bridge integration scheme for reducing interconnect delay

摘要

Air-bridges are formed at controlled lateral separations using the extremely high HF etch rate of a gap-fill spin-on-glass such as uncured hydrogen silsequioxane (HSQ) in combination with other dielectrics having a much slower etch rate in HF. The advantages of an air-bridge system with controlled lateral separations include providing an interconnect isolation dielectric which meets all requirements for sub-0.5 micron technologies and providing a device with reduced reliability problems.