Method of manufacturing surface-mountable SIL hybrid circuit

摘要

A method for manufacturing a SIL hybrid circuit is presented. A lead frame is provided which includes side bands and clip members between the side bands configured to connectively receive a hybrid circuit. The lead frame further includes foot members between the side bands configured to be surface-mounted to a base substrate. Each foot member has tabs at the ends thereof and support members extending straight from the tabs to connect the tabs to the side bands. Corresponding contact areas of the hybrid circuit are attached to the clip members. At least one foot member and associated support members are selected to remain in the lead frame to support the SIL hybrid circuit during positioning on the base substrate and surface mounting thereto. Excess parts are removed from the lead frame based on the selecting. As such, SIL hybrid circuits may be efficiently used to achieve high packaging densities.