| 摘要 |
PROBLEM TO BE SOLVED: To easily and reliably detect the end point of the polishing of CMP or the like. SOLUTION: This polishing device is provided with a polishing board 101 fitted with a polishing pad 103 having a plurality of conduction parts 109 separated from each other in the planar direction, a hold part 104 holding a substrate to be processed 106 to face its polished face to the polishing board 101 fitted with the polishing pad 103, drive parts 102 and 105 relatively moving the polishing board 101 and the hold part 104, and a detection part 111 detecting the conductive state of the polished face of the substrate to be worked 106 held by the hold part 104 via a plurality of conduction parts 109 provided on the polishing pad 103. |
