发明名称 Land grid package connector
摘要 An LGP connector comprises an insulative housing and a plurality of contacts. The housing defines a plurality of passageway sections for receiving the contacts therein. Each contact includes a soldering base for soldering the contact to a printed circuit board and an upper contact beam for electrically connecting the contact with an LGP chip, thereby electrically connecting the chip with the printed circuit board. Each contact comprises a pair of anti-rotation tabs extending from an end of the soldering base, and each passageway section transversely defines an anti-rotation cavity in a bottom face thereof and at a first side wall thereof for retaining the anti-rotation tabs of the contact.
申请公布号 US6296495(B1) 申请公布日期 2001.10.02
申请号 US20000535271 申请日期 2000.03.23
申请人 HON HAI PRECISION IND. CO., LTD. 发明人 WANG JWOMIN;LIN NICK;YU JUSTIN
分类号 H01R12/04;H01R13/631;(IPC1-7):H01R12/00 主分类号 H01R12/04
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