发明名称 |
LASER BEAM MACHINING DEVICE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a laser beam machining device with which a minute part is efficiently machined. SOLUTION: The laser machining device is characterized the laser machining device with which a work is machined by a laser beam (11) provided with an ultraviolet laser beam device (1) of a synchronized injection type equipped with an unstable resonators (45 and 46), a beam condenser array (29) having plural condensers (28) each of which is arranged respectively corresponding to the arrangement of a working zone (98) of a work (37), and an optical part (25) for intensity distribution transformation which transforms the intensity distribution of the laser beam (11) into an arbitrary distribution.</p> |
申请公布号 |
JP2001269789(A) |
申请公布日期 |
2001.10.02 |
申请号 |
JP20000257169 |
申请日期 |
2000.08.28 |
申请人 |
KOMATSU LTD |
发明人 |
SAJIKI KAZUAKI;SEKIZAWA NORIYUKI;NIWATSUKINO YOSHIYUKI;TABATA AKI |
分类号 |
B23K26/06;B23K26/067;B23K26/073;B23K26/38;B23K101/42;H01L21/268;H01S3/00;H05K3/00;(IPC1-7):B23K26/06 |
主分类号 |
B23K26/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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