摘要 |
PROBLEM TO BE SOLVED: To provide a filler for resin reinforcement, a resin composition compounded therewith, and a phenol resin molding material excellent in heat resistance, dimensional stability, moldability and in particular excellent in mechanical strength at a room and higher temperature. SOLUTION: This filler for resin reinforcement is prepared on 100 pts.wt. glass fiber by attaching 0.01-50 pts.wt. glass filler containing 30 wt.% or more SiO2 and having a particle diameter of 0.01-10μm, and this resin composition is prepared by compounding the resin with the filler.
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