发明名称 METHOD FOR BONDING PRINTED CIRCUIT BOARD WITH FRAME OF SHEET BUZZER BY USING TAPE
摘要 PURPOSE: A method for bonding a printed circuit board with a frame of a sheet buzzer by using a tape is provided to prevent deformation of the printed circuit board by minimizing pressure applied in a bonding process. CONSTITUTION: A method for bonding a printed circuit board(1) with a frame(6) of a sheet buzzer by using a tape(2) includes the steps of attaching the tape to the center of the top side of the printed circuit board, putting the frame on the printed circuit board and applying predetermined pressure for bonding the printed circuit board with the frame, winding a coil(10) on a pole(9) of the frame for being connected to patterns(4) of the printed circuit board, and successively bonding a magnet(11), a metal ring(12), a vibrating plate(13), and a case(14).
申请公布号 KR20010088948(A) 申请公布日期 2001.09.29
申请号 KR20010050225 申请日期 2001.08.21
申请人 KIM, JU YOUN;SAMBU COMMUNICS CO., LTD./KR 发明人 KIM, JU YOUN
分类号 G10K9/12;(IPC1-7):G10K9/12 主分类号 G10K9/12
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