发明名称 ELECTRONIC COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To provide an electronic component of the structure in which a resin sleeve is not damaged during conveying of the component. SOLUTION: The electronic component 1 comprises a component element 2 contained in a sheathing case 6 made of a metal and lead wires 4 each covered with a heat shrinkable resin sleeve in the case 6. In this case, ends of the wires 4 are each formed with a curved surface not having a sharp corner. Since the end of the wire 4 is formed with the curved surface not having the sharp corner, the end of the wire 4 does not damage the sleeve of another electronic component.</p>
申请公布号 JP2001267175(A) 申请公布日期 2001.09.28
申请号 JP20000075134 申请日期 2000.03.17
申请人 NIPPON CHEMICON CORP 发明人 ODAJIMA KATSUHIKO
分类号 H01G4/228;H01G9/008;H01G9/08;H01G13/00;(IPC1-7):H01G4/228 主分类号 H01G4/228
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