| 摘要 |
PROBLEM TO BE SOLVED: To secure adhering strength, to improve a quality and to lower a cost by simplifying structure, facilitating production, securing sufficient strength and realizing soldering and automatic mounting to a substrate, etc. SOLUTION: A fin for heat dissipation 1 obtained by bending a metallic plate is provided with plural fin 3 and a connection plane 4 integrally by bending the metallic plate. Furthermore, after bending the metallic plate to form the fin for heat dissipation, the fin for heat dissipation is soldered entirely and next, the fin for heat dissipation is heated to adhere and integrate solder to the fin soldering surface of the substrate, etc.
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