| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing device for semiconductor devices which exerts an approximately uniform pressure over the entire surface of a frame held between an upper and lower dies, which form cavities in only on one side of a chamber and have a center position off the center position of the frame. SOLUTION: Protrudent members 4e, 4f, projecting upwards to contact the downside 2a of an upper die 2 with a frame 6 sandwiched are provided at positions on an upper 4a of a lower die 4, except the sandwiching positions of the frame 6. In clamping the dies by a press drive apparatus (not shown), the protrudent members 4e, 4f share a part of a pressure exerted on the frame 6 to hold the downside 2a and the upside 4a approximately in parallel.
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