| 摘要 |
PROBLEM TO BE SOLVED: To connect a mask, a copper foil, and a resin layer by plating or conductive resin after opening with laser at the time of formation of a via in a wiring board. SOLUTION: A via is connected without remarkably increasing the thickness of a copper foil at the surface. A mask is formed on the copper foil at the surface, and this mask, the copper foil, and a resin layer are opened in substantially the same size, and they are connected with one another by plating or filling of conductive resin in this opening.
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