| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of filling a blind via or a through hole in a printed board with paste without leaving bubbles. SOLUTION: Paste is stuck within a blind via, and then a printed board is rotated with the opening of the bottomed via directed in the central direction of rotation so as to add centrifugal force to the paste. The bubbles within the paste collect to the surface of the paste by the centrifugal force and are discharged to outside, so the bubbles never remain in the paste.
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